Infineon and Foxconn have entered into a Memorandum of Understanding (MoU) to collaborate on the implementation of SiC (Silicon Carbide) technology in high-power automotive applications such as traction inverters, onboard chargers, and DC-DC converters.
The partnership aims to leverage Infineon's automotive system expertise, technical support, and SiC product offerings, along with Foxconn's electronic design and manufacturing capabilities and system-level integration expertise, to jointly develop electric vehicle (EV) solutions.
To facilitate their collaboration, both companies plan to establish a system application center in Taiwan. This center will serve as a hub for optimizing vehicle applications, including smart cabin applications, advanced driver assistance systems, and autonomous driving applications. Additionally, it will focus on addressing electromobility applications such as battery management systems and traction inverters.
The collaboration encompasses a broad range of Infineon's automotive products, including sensors, microcontrollers, power semiconductors, high-performance memories for specific applications, human-machine interface solutions, and security solutions.
The establishment of the system application center is expected to be completed by 2023, further expanding the scope of cooperation between Infineon and Foxconn in advancing SiC technology for automotive applications.
