Renesas has announced that a wide array of its radiation-hardened (rad-hard) integrated circuits (ICs) are being deployed in space aboard the Artemis 1 mission. This significant milestone involved the launch of hundreds of ICs, comprising 50 different part numbers, on November 16.
The Intersil-brand rad-hard ICs are playing a critical role in various systems on the Space Launch System (SLS), including battery management systems, the launch abort system, and RS-25 engine control electronics. The SLS, known as the most powerful rocket ever launched, propelled the Artemis 1 mission into space.
Artemis 1 carries the Orion capsule, which will orbit the moon. Renesas has supplied vital components for crucial systems such as controller boards, docking camera system, display and panel electronics, main flight computer, and power distribution components.
The Intersil-brand ICs are responsible for performing precise functions, including power management systems and precision signal processing. As the first mission in a series of NASA programs aiming to return humans to the moon after a 50-year hiatus, Artemis 1 will deploy CubeSats and conduct space experiments to thoroughly test all critical systems. Additionally, test mannequins will orbit the moon within the Orion Capsule. The entire Artemis 1 Mission is expected to span 42 days.
Artemis 2, scheduled for 2024, will involve sending a human crew to orbit the moon, while Artemis 3 in 2025 will mark the historic return of astronauts to the lunar surface after half a century. The crew of Artemis 3 will include the first woman and person of color to walk on the moon. Moreover, this ambitious program aims to establish a space station in lunar orbit and a base on the lunar South Pole.
Ultimately, the Artemis Mission seeks to establish an infrastructure that will facilitate future manned missions to Mars, marking an unprecedented advancement in space exploration.
